AMAOE HU-4 Stencil For HI CPU

The AMAOE HU-4 Stencil For HI CPU is a high-precision BGA reballing stencil developed for accurate HI CPU chip repair and motherboard rework applications. Manufactured from premium-grade stainless steel and crafted using advanced laser-cut technology, this stencil ensures precise solder ball placement and perfect alignment during CPU reballing procedures.

Designed for professional mobile repair technicians and advanced PCB repair specialists, the HU-4 stencil reduces solder bridging, improves solder joint strength, and enhances overall repair reliability. Its heat-resistant and corrosion-proof construction ensures durability and long-term use with hot air rework stations and reflow systems.

Whether you are performing CPU replacement, IC servicing, or detailed board-level repair, the AMAOE HU-4 stencil delivers clean, consistent, and professional-grade results every time.

Key Features:

• Specially designed for HI CPU BGA reballing
• Precision laser-cut stainless steel construction
• Ensures uniform solder ball alignment
• Minimizes solder bridging and short circuit risks
• High heat resistance for hot air and reflow soldering
• Durable, anti-rust, and reusable design
• Enhances solder joint reliability and conductivity
• Lightweight and easy PCB positioning
• Suitable for advanced motherboard repair
• Ideal for professional repair workshops

Technical Specifications:

• Brand: AMAOE
• Model: HU-4
• Material: Premium stainless steel
• Application: HI CPU BGA IC reballing
• Thickness: Approx. 0.12 mm – 0.15 mm
• Precision Tolerance: ±0.01 mm
• Surface Finish: Anti-corrosion metallic coating
• Reusable: Yes
• Weight: Approx. 10–20 g
• Compatibility: HI CPU IC chip layouts (model-specific design)