Amaoe BS-1 Stencil

The Amaoe BS-1 Stencil is a precision-engineered BGA reballing template developed for professional chip-level motherboard repair. Designed to deliver accurate solder ball placement, this stencil ensures perfect IC alignment during reballing and replacement procedures.

Crafted from premium stainless steel with advanced laser-cut technology, the BS-1 stencil offers excellent heat resistance, durability, and dimensional accuracy. It helps minimize solder bridging, improves solder joint strength, and increases overall repair efficiency for complex PCB rework tasks.

Whether you operate a mobile repair shop or an advanced service center, the Amaoe BS-1 stencil provides reliable performance and consistent results for professional IC reballing work.

Key Features:

• High-precision laser-cut BGA stencil
• Premium stainless steel construction
• Accurate solder ball positioning
• Minimizes solder bridging and short circuits
• Heat resistant for hot air & reflow soldering
• Durable, anti-rust, and reusable design
• Enhances solder joint reliability and conductivity
• Lightweight and easy to handle
• Suitable for CPU, power IC, and chipset repairs
• Ideal for professional motherboard servicing

Technical Specifications:

• Brand: Amaoe
• Model: BS-1
• Material: High-grade stainless steel
• Application: BGA IC reballing & PCB repair
• Thickness: Approx. 0.12 mm – 0.15 mm
• Precision Tolerance: ±0.01 mm
• Surface Finish: Anti-corrosion metallic coating
• Heat Compatibility: Supports hot air & reflow stations
• Reusable: Yes
• Weight: Approx. 10–20 g