Amaoe BS-2 Stencil

The Amaoe BS-2 Stencil is a professional-grade BGA reballing template engineered for accurate IC and motherboard repair. Designed for chip-level servicing, this stencil ensures precise solder ball placement and consistent alignment during reballing procedures.

Manufactured from premium stainless steel with advanced laser-cut technology, the BS-2 stencil delivers superior durability, high thermal resistance, and excellent dimensional accuracy. It helps minimize solder bridging, prevents short circuits, and enhances solder joint strength for long-lasting repair reliability.

Ideal for professional mobile repair technicians and service centers, the Amaoe BS-2 stencil improves workflow efficiency and ensures high-quality results in complex PCB rework tasks.

Key Features:

• Precision laser-cut BGA reballing stencil
• Premium stainless steel construction
• Accurate solder ball alignment
• Reduces solder bridging and short circuit risks
• High heat resistance for hot air & reflow stations
• Durable, anti-rust, and reusable design
• Improves solder joint reliability
• Suitable for CPU, power IC, and chip-level repairs
• Lightweight and easy positioning
• Ideal for professional repair workshops

Technical Specifications:

• Brand: Amaoe
• Model: BS-2
• Material: High-grade stainless steel
• Application: BGA IC reballing & motherboard repair
• Thickness: Approx. 0.12 mm – 0.15 mm
• Precision Tolerance: ±0.01 mm
• Heat Compatibility: Suitable for hot air & reflow soldering
• Surface Finish: Anti-corrosion metallic coating
• Reusable: Yes
• Weight: Approx. 10–20 g