AMAOE IP17 Pro Max Stencil

The AMAOE IP17PM-012 iPhone 17 Pro Max Stencil is a professional-grade reballing stencil designed specifically for iPhone 17 Pro Max motherboard repairs. Built for precision and reliability, this stencil ensures accurate alignment of solder balls, making it an essential tool for chip-level technicians.

Crafted from premium stainless steel, the stencil offers exceptional durability and high heat resistance, allowing it to perform consistently during repeated soldering processes. Its ultra-precise laser-cut holes provide perfect positioning for solder balls, reducing errors and improving repair success rates.

Designed for advanced mobile repair applications, the AMAOE IP17PM-012 supports efficient BGA reballing and IC maintenance. Whether you’re working in a professional repair lab or handling complex repairs, this stencil delivers consistent, high-quality results.

Compact, lightweight, and easy to use, it is an ideal choice for technicians who demand precision and efficiency in every repair.

Key Features:

• Designed for iPhone 17 Pro Max motherboard repair
• High-Precision Laser-Cut Design for accurate reballing
• Premium Stainless Steel Material for durability
• Heat Resistant & Anti-Deformation Structure
• Perfect Alignment for Solder Ball Placement
• Improves Repair Accuracy & Success Rate
• Reusable & Long-Lasting Performance
• Compact & Easy to Handle
• Ideal for Chip-Level Repair Technicians
• Professional Tool for Mobile Repair Labs

Technical Specifications:

• Product Name: AMAOE IP17PM-012 Stencil
• Model: IP17PM-012
• Compatibility: iPhone 17 Pro Max
• Material: High-quality stainless steel
• Type: BGA reballing stencil
• Manufacturing: Precision laser-cut
• Heat Resistance: High temperature resistant
• Thickness: Ultra-thin precision sheet
• Application: IC reballing, motherboard repair
• Durability: Anti-warp, reusable
• Usage: Professional mobile repair