Amaoe M13P-012 Network Stencil
Rs.238.00
The Amaoe M13P-012 stencil is a high-precision stainless steel BGA stencil designed for Xiaomi 13 Pro mid-layer network IC reballing and motherboard repair.
Amaoe M13P-012 Mid-Layer Network Stencil for Xiaomi 13 Pro Motherboard Reballing
The Amaoe M13P-012 Mid-Layer Network Stencil is a professional BGA reballing stencil designed for Xiaomi 13 Pro motherboard repair, specifically for the mid-layer network IC section. This precision repair tool allows technicians to accurately rebuild solder balls and restore network chip connections during advanced smartphone motherboard repair.
Manufactured using high-quality stainless steel with precision laser cutting, the stencil features perfectly aligned holes that ensure accurate solder ball placement and reliable chip alignment. The ultra-thin design provides excellent heat transfer during soldering, allowing technicians to achieve stable and clean reballing results while reducing the risk of solder bridging.
The Amaoe M13P-012 stencil is engineered specifically for Xiaomi 13 Pro mid-layer network IC reballing, making it an essential tool for chip-level repair, micro-soldering, and motherboard restoration. Its durable and reusable construction ensures long-lasting performance for technicians who regularly perform advanced smartphone repairs.
Ideal for GSM repair technicians, mobile repair laboratories, and electronics service centers, the Amaoe M13P-012 stencil delivers professional-grade precision and reliability for complex motherboard reballing tasks.
Key Features
- Specially designed for Xiaomi 13 Pro mid-layer network motherboard repair
- Precision laser-cut hole pattern for accurate solder ball placement
- Made from premium stainless steel for durability and long life
- Ultra-thin stencil design for efficient heat transfer during soldering
- Ensures precise IC alignment and stable reballing results
- Helps prevent solder bridging and misalignment issues
- Suitable for network IC and chip-level motherboard repair
- Reusable professional BGA stencil for repeated use
- Ideal for mobile repair technicians and GSM service centers
- Trusted Amaoe professional repair tool quality
Technical Specifications
| Specification | Details |
|---|---|
| Product Name | Amaoe M13P-012 Mid-Layer Network Stencil |
| Brand | Amaoe |
| Model | M13P-012 |
| Compatibility | Xiaomi 13 Pro |
| Product Type | BGA Reballing Stencil |
| Application | Mid-Layer Network IC Reballing |
| Material | High-Quality Stainless Steel |
| Manufacturing Process | Precision Laser Cutting |
| Thickness | Ultra-Thin |
| Usage | Smartphone Motherboard Repair |
| Weight | 0.020 kg |
|---|---|
| Dimensions | 15 × 12 × 10 cm |
