Amaoe MZ-2 Stencil

The Amaoe MZ-2 Stencil is a professional-grade BGA reballing stencil engineered for precise IC chip repair and motherboard rework applications. Crafted from premium stainless steel and manufactured using advanced laser-cut technology, this stencil ensures accurate solder ball alignment and uniform solder paste distribution for consistent reballing performance.

Designed for professional mobile repair technicians and PCB specialists, the MZ-2 stencil minimizes solder bridging, enhances solder joint durability, and improves overall repair efficiency. Its heat-resistant and corrosion-proof construction allows repeated use with hot air stations and reflow systems without warping or performance loss.

Whether you’re replacing BGA chips, repairing motherboard circuits, or performing detailed IC servicing, the Amaoe MZ-2 stencil delivers reliable, clean, and professional-level results every time.

Key Features:

• Precision laser-cut stainless steel construction
• Designed for accurate BGA IC reballing
• Ensures uniform solder ball placement
• Reduces solder bridging and alignment errors
• High heat resistance for hot air and reflow soldering
• Durable, anti-rust, and reusable design
• Improves solder joint strength and electrical conductivity
• Lightweight and easy PCB positioning
• Suitable for advanced board-level repairs
• Ideal for professional repair workshops

Technical Specifications:

• Brand: Amaoe
• Model: MZ-2
• Material: Premium stainless steel
• Application: BGA IC reballing and motherboard repair
• Thickness: Approx. 0.12 mm – 0.15 mm
• Precision Tolerance: ±0.01 mm
• Surface Finish: Anti-corrosion metallic coating
• Reusable: Yes
• Weight: Approx. 10–20 g
• Compatibility: Various BGA IC chip layouts (model-specific design)