Amaoe QU-7 Stencil for Qualcomm CPU
The Amaoe QU-7 Stencil for Qualcomm CPU is a high-precision BGA reballing stencil engineered to deliver professional repair results on Qualcomm CPU and chipset boards. Crafted from premium stainless steel with advanced laser-cut technology, this stencil ensures precise solder ball placement and uniform alignment during critical rework and reballing jobs.
Designed for mobile repair technicians and PCB specialists, the QU-7 stencil significantly reduces solder bridging and improves joint quality for Qualcomm CPUs, power ICs, and high-density BGA chips. Its heat-resistant and corrosion-proof construction makes it ideal for frequent use with hot-air stations, reflow ovens, and solder paste workflows — boosting accuracy and reliability on every project.
Whether you’re performing logic board repairs, CPU replacements, or detailed BGA rework, the Amaoe QU-7 Stencil offers unmatched precision and durability for complex mobile and electronics repair tasks.
Key Features:
- Precision laser-cut design for accurate Qualcomm CPU BGA reballing
- Premium stainless steel construction for durability and strength
- Ensures uniform solder ball placement and perfect alignment
- Minimizes solder bridging, short circuits, and rework errors
- Heat-resistant and corrosion-proof material
- Reusable and easy to clean after each use
- Ideal for professional mobile/motherboard repair shops
- Supports hot air, reflow, and manual soldering workflows
- Lightweight and easy to position on small PCBs
- Perfect for advanced repair technicians
Technical Specifications:
- Brand: Amaoe
- Model: QU-7
- Material: High-quality stainless steel
- Application: Qualcomm CPU BGA reballing and motherboard repair
- Compatible Chips: Qualcomm CPU & high-density BGA packages
- Thickness: Approx. 0.12 mm – 0.15 mm
- Precision Tolerance: ±0.01 mm
- Surface Finish: Anti-rust metallic coating
- Reusable: Yes
- Weight: Approx. 10–20g
- Use Case: Mobile repair benches, professional tech labs











