Amaoe Sam-1 stencil for S8/S8+/Note8
The Amaoe Sam-1 Stencil for S8/S8+/Note8 is a professional-grade BGA reballing tool specially engineered for motherboard repair on Samsung S8, S8 Plus, and Note8 devices. Designed for experienced technicians, this stencil ensures precise solder ball alignment during CPU and chipset rework.
Made from high-quality stainless steel, the Sam-1 stencil features precision laser-cut apertures that provide accurate solder paste application and uniform ball distribution. Its ultra-thin construction allows perfect chip positioning while minimizing solder bridging and alignment errors.
Built to withstand high temperatures during reflow processes, this stencil is reusable, durable, and ideal for repeated workshop use. Whether performing CPU reballing, chip replacement, or board-level repairs, the Amaoe Sam-1 stencil improves repair efficiency and increases success rates.
⭐ Key Features
- Designed for S8, S8+ and Note8 motherboard repair
- High-precision laser-cut hole alignment
- Durable stainless steel construction
- Ensures uniform solder ball distribution
- Ultra-thin design for accurate chip positioning
- Heat-resistant for repeated BGA reflow cycles
- Reduces solder bridging and short circuits
- Reusable and easy to clean
- Professional tool for advanced technicians
- Enhances repair accuracy and workflow efficiency
📐 Technical Specifications
| Specification | Details |
|---|---|
| Product Name | Amaoe Sam-1 Stencil |
| Application | CPU / BGA reballing |
| Compatible Models | S8 / S8+ / Note8 |
| Material | High-grade stainless steel |
| Manufacturing Process | Precision laser cutting |
| Thickness | Ultra-thin precision stencil |
| Heat Resistance | High temperature resistant |
| Reusability | Yes |
| Use Case | Smartphone motherboard repair |
| Category | BGA reballing stencil |














