Amaoe SM-F700F/U Stencil

Amaoe SM-F700F/U Stencil for Samsung Galaxy Z Flip Middle Layer Motherboard Reballing

The Amaoe SM-F700F/U Stencil is a precision BGA reballing stencil specially designed for repairing the middle layer motherboard of Samsung Galaxy Z Flip (SM-F700F / SM-F700U) smartphones. Engineered for professional technicians, this stencil enables accurate solder ball placement and chip alignment during complex motherboard reballing procedures.

Manufactured from premium-grade stainless steel using high-precision laser cutting, the stencil ensures perfectly aligned holes for reliable solder ball formation. Its ultra-thin structure allows excellent heat transfer during soldering, helping technicians achieve clean and uniform solder joints while minimizing the risk of solder bridging.

The Amaoe SM-F700F/U stencil is an essential tool for chip-level repair, motherboard restoration, and micro-soldering work on Samsung foldable devices. With durable construction and reusable design, it provides consistent performance for professional GSM repair technicians and mobile repair workshops.

Whether performing CPU, IC, or motherboard middle layer repairs, this stencil helps ensure accurate and efficient reballing results.

Key Features

• Designed for Samsung Galaxy Z Flip SM-F700F / SM-F700U motherboard reballing
• Ideal for middle layer motherboard chip repair
• High-precision laser-cut holes for accurate solder ball placement
• Made from premium stainless steel for durability
• Ultra-thin design for efficient heat distribution during soldering
• Ensures perfect chip alignment during reballing process
• Reduces solder bridging and improves repair precision
• Reusable professional repair stencil
• Suitable for advanced micro-soldering and chip repair
• Trusted Amaoe professional repair quality

Technical Specifications