Amaoe SWT-1 Stencil
Rs.345.00
Amaoe SWT-1 Stencil is a precision stainless steel BGA stencil designed for accurate IC reballing and professional smartphone motherboard repair work.
Amaoe SWT-1 Stencil – Precision BGA Reballing Stencil for Mobile IC Repair
The Amaoe SWT-1 Stencil is a high-precision BGA reballing stencil designed for professional mobile motherboard IC repair and rework. Manufactured with premium stainless steel and advanced laser cutting technology, this stencil ensures accurate solder ball alignment and reliable reballing results.
The SWT-1 stencil is engineered for technicians working with delicate smartphone IC chips. Its ultra-thin design allows smooth solder paste application while maintaining excellent heat resistance during the reballing process. The precision holes help reduce solder bridging and improve repair success rates.
Perfect for mobile repair shops, technicians, and professional laboratories, the Amaoe SWT-1 stencil delivers durability, accuracy, and efficiency for daily motherboard repair work.
Key Features
- High-precision laser-cut BGA stencil
- Premium stainless steel construction
- Designed for professional mobile motherboard IC reballing
- Ultra-thin design for accurate solder ball placement
- High heat resistance for soldering and rework processes
- Reduces solder bridging and improves repair accuracy
- Durable, anti-deformation material
- Ideal for mobile phone repair technicians and GSM workshops
Technical Specifications
| Specification | Details |
|---|---|
| Product Name | Amaoe SWT-1 Stencil |
| Brand | Amaoe |
| Material | High-quality Stainless Steel |
| Type | BGA Reballing Stencil |
| Application | Mobile IC Reballing / Motherboard Repair |
| Manufacturing | Precision Laser Cut |
| Heat Resistance | High Temperature Resistant |
| Usage | Professional Mobile Repair |
| Weight | 0.020 kg |
|---|---|
| Dimensions | 15 × 12 × 10 cm |
