AMAOE IP14 Pro/Max Stencil

AMAOE IP14 Pro/Max Stencil – Precision BGA Reballing Stencil for iPhone 14 Pro & 14 Pro Max

The AMAOE IP14 Pro/Max Stencil is a high-precision BGA reballing stencil specially engineered for iPhone 14 Pro and iPhone 14 Pro Max motherboard IC repairs. Manufactured using premium-grade stainless steel and advanced laser cutting technology, this stencil ensures precise solder ball alignment for professional chip reballing.

Designed for mobile repair technicians and advanced repair labs, the stencil provides accurate positioning for delicate IC components. Its ultra-thin yet durable structure allows smooth solder paste application while maintaining excellent heat resistance during high-temperature reballing processes.

Whether performing CPU, baseband, or motherboard IC repairs, the AMAOE IP14 Pro/Max stencil delivers reliable accuracy, making it an essential tool for modern smartphone repair professionals.

Key Features

• Specially designed for iPhone 14 Pro / iPhone 14 Pro Max
• High-precision laser-cut stainless steel construction
• Ultra-thin design for accurate BGA reballing
• Excellent heat resistance for professional soldering work
• Perfect alignment for motherboard IC solder ball placement
• Durable and anti-deformation material for long-term use
• Reduces solder bridging and improves repair success rate
• Ideal for professional mobile phone motherboard repairs

Technical Specifications