Amaoe IP14/PLUS Stencil
Rs.238.00
Amaoe IP14/Plus Stencil is a precision stainless-steel BGA reballing stencil designed for iPhone 14 and 14 Plus motherboard IC repair, ensuring accurate solder ball placement.
Amaoe IP14/PLUS Stencil – Professional BGA Reballing Stencil for iPhone 14 Series
The Amaoe IP14/Plus Stencil is a high-precision BGA reballing stencil specially designed for iPhone 14 and iPhone 14 Plus motherboard IC repair. Built with premium stainless steel and laser-cut technology, this stencil ensures accurate solder ball placement, making it an essential tool for professional mobile repair technicians.
Its durable construction and ultra-fine mesh design allow precise alignment for IC reballing and chipset repairs. The stencil supports efficient solder paste application and reduces the risk of bridging or misalignment, improving repair success rates.
Perfect for advanced technicians and repair labs, the Amaoe IP14/Plus Stencil helps deliver reliable motherboard repair results while saving time and effort.
Key Features
- Precision laser-cut stainless steel stencil
- Designed specifically for iPhone 14 / 14 Plus motherboard IC reballing
- High heat resistance for repeated professional use
- Accurate hole alignment for perfect solder ball placement
- Ultra-thin design for smooth solder paste application
- Durable and anti-deformation structure
- Ideal for BGA reballing, chip repair, and motherboard maintenance
- Suitable for professional mobile repairing technicians
Technical Specifications
| Specification | Details |
|---|---|
| Product Name | Amaoe IP14/Plus Stencil |
| Brand | Amaoe |
| Material | High-quality Stainless Steel |
| Compatibility | iPhone 14 / iPhone 14 Plus |
| Application | BGA IC Reballing |
| Heat Resistance | High Temperature Resistant |
| Cutting Technology | Precision Laser Cut |
| Thickness | Ultra-Thin Professional Grade |
| Weight | 0.020 kg |
|---|---|
| Dimensions | 15 × 12 × 10 cm |
