Amaoe U-APU1 Stencil

The Amaoe U-APU1 Stencil is a professional BGA reballing stencil designed for precise APU/CPU chip reballing and motherboard IC repair. It is an essential tool for technicians performing advanced mobile motherboard micro-soldering and chip-level repair.

Made from high-quality stainless steel with precision laser-cut technology, the Amaoe U-APU1 stencil ensures accurate solder ball placement and perfect IC alignment during the reballing process. Its ultra-thin and durable construction allows technicians to apply solder paste smoothly while maintaining stable positioning of the chip.

This stencil is ideal for mobile repair professionals, technicians, and service centers that handle complex CPU/APU BGA reballing tasks. The Amaoe U-APU1 helps improve repair accuracy, reduce solder bridging, and increase overall repair efficiency.

Key Features

• Designed for APU / CPU BGA reballing applications
• Precision laser-cut holes for accurate solder ball placement
• Made from premium stainless steel for long-lasting durability
• Ultra-thin design for perfect chip alignment
• High temperature resistance during soldering processes
• Improves reballing precision and repair success rate
• Compatible with various motherboard APU/CPU IC repairs
• Ideal for professional mobile repair technicians

Technical Specifications