Amaoe U-APU2 Stencil
Rs.238.00
The Amaoe U-APU2 Stencil is a precision stainless steel BGA reballing stencil for CPU/APU IC repair, designed for accurate solder ball placement in professional mobile motherboard repairs.
Amaoe U-APU2 Stencil
The Amaoe U-APU2 Stencil is a professional BGA reballing stencil engineered for precise APU/CPU IC reballing and advanced motherboard repair. It is designed for technicians who perform detailed chip-level mobile repair and micro-soldering work on modern smartphone motherboards.
Crafted from high-quality stainless steel with precision laser-cut holes, the Amaoe U-APU2 stencil provides excellent alignment for solder balls and ensures accurate IC placement during the reballing process. Its ultra-thin design allows smooth solder paste application while maintaining stability under high temperatures during soldering.
The Amaoe U-APU2 stencil is widely used in professional mobile repair labs and service centers, helping technicians perform reliable CPU/APU chip reballing while improving repair efficiency and minimizing solder bridging issues.
Key Features
- Designed for APU / CPU BGA IC reballing
- High-precision laser-cut holes for accurate solder ball placement
- Made from premium stainless steel material
- Ultra-thin design for perfect chip alignment
- High heat resistance for soldering and rework processes
- Helps reduce solder bridging and alignment errors
- Durable and suitable for long-term professional use
- Ideal for mobile motherboard chip repair technicians
Technical Specifications
| Specification | Details |
|---|---|
| Product Name | Amaoe U-APU2 Stencil |
| Brand | Amaoe |
| Model | U-APU2 |
| Material | High Quality Stainless Steel |
| Type | BGA Reballing Stencil |
| Application | CPU / APU IC Reballing |
| Manufacturing | Precision Laser Cut |
| Heat Resistance | High Temperature Resistant |
| Usage | Smartphone Motherboard Repair |
| Category | Mobile Repair Tool |
| Weight | 0.020 kg |
|---|---|
| Dimensions | 15 × 12 × 10 cm |
