AMAOE U-SMG1 Stencil
The AMAOE U-SMG1 Stencil is a professional BGA reballing stencil designed for precise CPU, RAM, and IC chip repair on smartphone motherboards. Built with high-quality stainless steel and advanced laser cutting technology, this stencil ensures perfect solder ball alignment during the reballing process.
The ultra-thin design allows technicians to easily position the stencil over IC chips, delivering consistent solder ball placement and reliable repair results. It is widely used by mobile repair professionals for chip-level motherboard repairs, helping restore damaged chips efficiently and accurately.
Whether you are repairing smartphones in a professional repair lab or service center, the Amaoe U-SMG1 stencil is a reliable tool that improves repair speed, precision, and overall efficiency in BGA rework and reballing tasks.
Key Features
- Precision BGA reballing stencil for CPU, RAM, and IC chips
- High-quality stainless steel construction for durability
- Laser-cut holes for accurate solder ball positioning
- Ultra-thin design for easy chip alignment
- Heat-resistant material suitable for soldering processes
- Ensures uniform solder ball distribution
- Reusable and long-lasting repair tool
- Designed for professional motherboard repair technicians
- Improves repair accuracy and efficiency
- Ideal for advanced chip-level mobile phone repairs
Technical Specifications
- Product Name: AMAOE U-SMG1 Stencil
- Brand: Amaoe
- Material: Premium Stainless Steel
- Type: BGA Reballing Stencil
- Manufacturing Process: Precision Laser Cutting
- Application: CPU / RAM / IC Chip Reballing
- Compatibility: Smartphone Motherboards
- Heat Resistance: High Temperature Resistant
- Usage: Professional Mobile Repair
- Reusability: Yes
