Amaoe U-SMG2 Stencil
The Amaoe U-SMG2 Stencil is a high-precision BGA reballing stencil designed for professional smartphone motherboard repair. It is specially engineered for accurate CPU, RAM, and IC chip reballing, helping technicians restore damaged or faulty chips with perfect solder ball alignment.
Manufactured using premium stainless steel with precision laser-cut technology, the stencil ensures uniform solder ball placement and reliable performance during chip-level repairs. Its ultra-thin and heat-resistant design allows easy positioning over IC chips while maintaining stability during soldering.
Ideal for professional mobile repair technicians, the Amaoe U-SMG2 stencil improves efficiency, accuracy, and reliability in advanced motherboard repair work. Whether used in repair shops or professional labs, it is an essential tool for precise BGA chip rework and reballing operations.
Key Features
- Professional BGA stencil for CPU, RAM, and IC reballing
- High-precision laser cut holes for accurate solder ball placement
- Made from durable stainless steel material
- Ultra-thin design for easy chip alignment
- Excellent heat resistance during soldering process
- Ensures uniform solder ball distribution
- Reusable and long-lasting repair tool
- Improves repair accuracy and efficiency
- Suitable for advanced motherboard chip repairs
- Perfect tool for professional GSM technicians
Technical Specifications
- Product Name: Amaoe U-SMG2 Stencil
- Brand: Amaoe
- Material: High Quality Stainless Steel
- Type: BGA Reballing Stencil
- Manufacturing Method: Precision Laser Cutting
- Application: CPU / RAM / IC Reballing
- Compatibility: Smartphone Motherboards
- Heat Resistance: High Temperature Resistant
- Usage: Professional Mobile Phone Repair
- Reusability: Yes
