Amaoe U-SMG3 Stencil

The Amaoe U-SMG3 Stencil is a professional-grade BGA reballing stencil designed for precise repair of smartphone CPU, RAM, and IC chips. Built with high-quality stainless steel and advanced laser-cut technology, this stencil ensures accurate solder ball placement for reliable chip reballing and motherboard repair.

The ultra-thin yet durable structure allows technicians to perform efficient reballing without misalignment or overheating issues. Its precision hole design helps maintain consistent solder ball size and positioning, which is essential for successful chip-level repair.

Perfect for professional GSM technicians and mobile repair laboratories, the Amaoe U-SMG3 stencil improves repair accuracy, reduces working time, and delivers dependable results during advanced motherboard maintenance and IC rework operations.

Key Features

• Professional BGA reballing stencil for smartphone IC repair
• Precision laser-cut holes for perfect solder ball alignment
• Made from high-quality stainless steel material
• Ultra-thin flexible design for easy chip positioning
• High temperature resistance during soldering
• Ensures uniform solder ball distribution
• Improves accuracy and efficiency in chip reballing
• Durable and reusable repair tool
• Suitable for CPU, RAM, and IC rework
• Ideal for mobile phone motherboard repair technicians

Technical Specifications

• Product Name: Amaoe U-SMG3 Stencil
• Brand: Amaoe
• Material: Premium Stainless Steel
• Type: BGA Reballing Stencil
• Manufacturing Process: Precision Laser Cutting
• Application: CPU / RAM / IC Reballing
• Compatibility: Smartphone Motherboards
• Heat Resistance: High Temperature Resistant
• Usage: Professional Mobile Phone Repair
• Reusability: Yes