Amaoe U-SMG4 Stencil

The Amaoe U-SMG4 Stencil is a high-precision BGA reballing stencil designed for professional mobile phone motherboard repair. This stencil is specially engineered to assist technicians in accurately reballing CPU, RAM, and IC chips during advanced chip-level repairs.

Manufactured with premium-grade stainless steel and precision laser cutting technology, the Amaoe U-SMG4 stencil ensures perfect hole alignment and consistent solder ball placement. Its ultra-thin design provides excellent flexibility and heat resistance, allowing smooth and accurate reballing without damaging delicate components.

Ideal for professional repair technicians and mobile service centers, the Amaoe U-SMG4 stencil improves repair efficiency, enhances soldering accuracy, and helps restore damaged chips with reliable results. It is a must-have tool for smartphone motherboard maintenance and BGA chip rework.

Key Features

• Professional BGA reballing stencil for CPU and IC chips
• Precision laser-cut holes for accurate solder ball alignment
• Made from high-quality stainless steel for durability
• Ultra-thin design for better chip positioning
• Excellent heat resistance for soldering and reballing work
• Ensures uniform solder ball distribution
• Suitable for advanced mobile motherboard repair
• Reusable and long-lasting repair tool
• Ideal for professional GSM repair technicians
• Improves repair accuracy and efficiency

Technical Specifications

• Product Name: Amaoe U-SMG4 Stencil
• Brand: Amaoe
• Material: High-Quality Stainless Steel
• Type: BGA Reballing Stencil
• Manufacturing: Precision Laser Cutting
• Application: CPU / RAM / IC Reballing
• Compatibility: Smartphone Motherboards
• Heat Resistance: High Temperature Resistant
• Usage: Mobile Phone Chip-Level Repair
• Reusability: Yes