Amaoe U-SMG5 Stencil

The Amaoe U-SMG5 Stencil is a professional BGA reballing stencil designed for accurate CPU and IC chip reballing during advanced smartphone motherboard repairs. Manufactured using high-precision laser cutting technology, this stencil ensures perfect alignment and consistent solder ball placement for reliable chip restoration.

Made from premium stainless steel, the Amaoe U-SMG5 stencil offers excellent durability, heat resistance, and long-term usability. Its ultra-thin design allows technicians to perform precise soldering work without damaging sensitive components. This stencil is widely used by professional mobile repair technicians for reballing CPU, RAM, and motherboard IC chips with maximum efficiency.

The Amaoe U-SMG5 stencil is an essential tool for repair shops and technicians who require precision, reliability, and consistent results in mobile motherboard repair and chip-level servicing.

Key Features

• High-precision BGA reballing stencil for CPU and IC chips
• Laser-cut hole design for accurate solder ball positioning
• Made from high-quality stainless steel for durability
• Ultra-thin and flexible design for easy alignment
• Excellent heat resistance for soldering processes
• Ensures stable and uniform solder joints
• Suitable for professional mobile motherboard repair
• Reusable and long-lasting repair tool

Technical Specifications

• Product Name: Amaoe U-SMG5 Stencil
• Brand: Amaoe
• Material: Premium Stainless Steel
• Type: BGA Reballing Stencil
• Manufacturing Process: Precision Laser Cutting
• Compatibility: CPU / RAM / IC Chips
• Application: Smartphone Motherboard Repair
• Heat Resistance: High Temperature Resistant
• Reusability: Yes
• Usage: Chip Reballing & IC Repair