AMAOE Z60U-XB-012 Stencil for ZTE Nubia Z60 Ultra 5G
The AMAOE Z60U-XB-012 Stencil for ZTE Nubia Z60 Ultra 5G is a high-precision BGA reballing stencil specifically engineered for professional motherboard repair and IC rework applications. Designed to match the chipset layout and solder ball configuration of the ZTE Nubia Z60 Ultra 5G, this stencil enables accurate solder ball placement, helping technicians perform reliable chip-level repairs with greater efficiency.
Manufactured from premium-grade stainless steel using precision laser-cut technology, the Z60U-XB-012 delivers exceptional accuracy, durability, and heat resistance. The ultra-precise apertures ensure consistent solder ball alignment, reducing rework errors and improving repair success rates during CPU, RAM, and IC reballing operations.
Its reusable design withstands repeated heating cycles without deformation, making it an essential tool for professional mobile phone repair workshops and advanced motherboard repair technicians. Whether you’re repairing damaged chips, replacing ICs, or performing BGA reballing procedures, the AMAOE stencil provides stable and dependable performance.
Ideal for chip-level repair specialists, this stencil helps restore motherboard functionality while maintaining professional repair standards.
Key Features:
- 🔧 Precision BGA reballing stencil for ZTE Nubia Z60 Ultra 5G
- 🎯 Accurate solder ball positioning and alignment
- 💪 Premium stainless steel construction for durability
- 🔥 High-temperature resistant for repeated use
- ⚡ Precision laser-cut apertures for reliable reballing
- 🛠️ Suitable for CPU, RAM, and IC repair work
- 📱 Designed specifically for ZTE Nubia Z60 Ultra 5G motherboard repairs
- 🔍 Improves repair accuracy and success rate
- ♻️ Reusable design with long service life
- 🚀 Ideal for professional chip-level repair technicians
Technical Specifications:
- Brand: AMAOE
- Model: Z60U-XB-012
- Product Type: BGA Reballing Stencil
- Compatible Device: ZTE Nubia Z60 Ultra 5G
- Material: High-Quality Stainless Steel
- Manufacturing Process: Precision Laser Cutting
- Function: IC Reballing and Chip Repair
- Features: Heat Resistant, Durable, Reusable
- Application: Motherboard Repair, CPU Reballing, IC Maintenance
- Suitable For: Mobile Phone Repair Technicians and Service Centers











