AMAOE EMMC2 BGA REBALLING STENCIL FOR EMMC/EMCP/UFS IC CHIP 0.15MM

AMAOE EMMC2 BGA Reballing Stencil – Precision Chip Repair Tool

The AMAOE EMMC2 BGA Reballing Stencil is engineered for mobile repair technicians and electronics specialists who need consistent and accurate reballing performance. This high-precision stencil is designed to support a wide range of eMMC/EMCP/UFS chip packages, allowing for efficient solder ball application during chip-level servicing and motherboard repair.

Made with durable, deformation-resistant stainless steel, the EMMC2 stencil features a 0.15 mm mesh pattern that ensures precise alignment and uniform solder distribution. Whether you’re restoring memory ICs, rebuilding solder balls, or preparing chips for rework, this stencil helps reduce errors and improve repair quality.

Key Features:

• Precision 0.15 mm laser-cut BGA design for optimal reballing accuracy
• Compatible with eMMC, EMCP, and UFS IC chips
• Durable, deformation-resistant stainless steel build
• Uniform square and round hole pattern for consistent solder ball placement
• Ideal for solder tin planting & reballing work
• Reduces bridging and alignment errors during repair
• Works with multiple BGA package sizes (e.g., BGA221, BGA153)
• Heat-resistant and reusable construction
• Perfect tool for mobile technicians and repair labs

Technical Specifications:

• Brand: AMAOE
• Model: EMMC2 BGA Stencil
• Supported IC Types: eMMC, EMCP, UFS Chips
• Stencil Thickness: 0.15 mm
• Material: High-grade stainless steel
• Pattern Type: Laser-cut BGA apertures
• Compatibility: Multiple BGA package layouts including standard memory packages
• Usage: CPU/Memory IC reballing and rework
• Usage Level: Professional/mobile repair technician