Product Name: JTX SM06 iPhone 13 / 13 Pro / 13 Pro Max JTX IP Swap Board Chips Reballing Platform (1 Blue Module + 1 Stencil)
The JTX SM06 iPhone 13 Reballing Platform is a professional repair tool designed specifically for iPhone 13, iPhone 13 Pro, and iPhone 13 Pro Max motherboard chip reballing and IP swap operations. Built for advanced mobile repair technicians, this platform provides precise chip positioning, improved stability, and accurate soldering alignment.
This kit includes 1 high-precision blue positioning module and 1 dedicated stencil, allowing technicians to easily perform CPU, NAND, and motherboard chip reballing during complex repair procedures such as IP swap or logic board restoration.
Manufactured using high-quality CNC-machined aluminum alloy, the JTX SM06 platform ensures durability, heat resistance, and precise chip alignment. The carefully designed slot structure securely holds chips in place during soldering, reducing movement and improving repair accuracy.
Whether you are performing logic board repair, chip reballing, or motherboard reconstruction, the JTX SM06 reballing platform offers reliable performance and professional-grade results for modern smartphone repair labs.
Key Features
• Designed specifically for iPhone 13 / 13 Pro / 13 Pro Max motherboard chip repair
• Ideal for IP swap board repair and chip reballing tasks
• Includes 1 precision blue positioning module
• Comes with 1 dedicated reballing stencil
• Provides accurate chip alignment for precise soldering
• CNC-machined aluminum alloy construction for durability
• Heat resistant and stable during soldering process
• Improves repair efficiency and reduces chip movement
• Compact design suitable for professional repair workstations
• Essential tool for advanced motherboard and chip-level repair
Technical Specifications
Product Model: JTX SM06
Compatible Models: iPhone 13 / iPhone 13 Pro / iPhone 13 Pro Max
Tool Type: IP Swap Board Chip Reballing Platform
Material: CNC Aluminum Alloy + Steel Stencil
Module Color: Blue
Included Components: 1 Blue Module + 1 Reballing Stencil
Application: CPU / NAND / motherboard chip reballing
Usage: Mobile phone motherboard repair and IP swap operations
Precision Level: High-precision positioning structure
| Weight | 0.100 kg |
|---|---|
| Dimensions | 20 × 18 × 15 cm |
