Luowei CPU Series BGA Reballing Stencil Set
The Luowei CPU Series BGA Reballing Stencil Set for Apple / Hisilicon Kirin / MediaTek / Qualcomm is a professional chip-level repair toolkit designed for CPU reballing, IC maintenance, and advanced motherboard repair applications. Engineered for electronics repair technicians and mobile refurbishment professionals, this precision stencil set delivers accurate solder ball alignment and efficient reballing performance for multiple mainstream processor platforms.
Compatible with Apple, Hisilicon Kirin, MediaTek, and Qualcomm CPU chipsets, the stencil set supports a wide range of smartphone motherboard repair and BGA rework operations. The precision laser-cut stencil structure ensures accurate solder positioning, stable alignment, and reliable chip restoration during delicate repair procedures.
Manufactured using high-quality heat-resistant steel material, the Luowei CPU Series stencil set provides excellent durability, anti-deformation performance, and long-lasting professional reliability under high-temperature soldering conditions. Its ultra-precise opening design improves solder consistency while reducing repair errors during CPU reballing tasks.
Ideal for motherboard refurbishment, IC replacement, BGA soldering, and chip-level diagnostics, the Luowei CPU Series BGA Reballing Stencil Set is an essential tool for professional repair laboratories and advanced mobile maintenance workshops.
Key Features:
- Professional CPU BGA Reballing Stencil Set
- Supports Apple, Kirin, MediaTek & Qualcomm CPUs
- High-Precision Laser-Cut Stencil Design
- Ideal for Chip-Level Motherboard Repair
- Accurate Solder Ball Alignment Performance
- Heat-Resistant Durable Steel Construction
- Stable Reliable High-Temperature Operation
- Suitable for IC Replacement & BGA Rework
- Improves Repair Accuracy & Efficiency
- Perfect for Professional Repair Workshops
Technical Specifications:
- Product Name: Luowei CPU Series BGA Reballing Stencil Set
- Type: CPU reballing stencil toolkit
- Compatibility: Apple / Hisilicon Kirin / MediaTek / Qualcomm CPUs
- Material: High-temperature resistant steel
- Function: CPU IC reballing and solder alignment
- Application: Motherboard repair and BGA maintenance
- Design: Precision laser-cut stencil openings
- Features: Durable, accurate, and reusable structure
- Usage: Chip-level repair and IC replacement
- Suitable For: Technicians and electronics repair laboratories
| Weight | 0.10 kg |
|---|---|
| Dimensions | 12 × 10 × 10 cm |
