MaAnt IP8–8P-X Stencil for iPhone 8 / 8 Plus BGA Reballing

MaAnt IP8–8P-X Stencil for iPhone 8 / 8 Plus BGA Reballing & IC Repair

The MaAnt IP8-8P-X Stencil is a precision-engineered reballing tool designed specifically for iPhone 8 and iPhone 8 Plus IC repair. Crafted for accurate BGA reballing and solder ball placement, this stencil ensures perfect alignment of solder balls, resulting in reliable and professional repair outcomes.

Made from high-quality stainless steel, the stencil offers excellent durability, heat resistance, and long-term usability. Its ultra-precise laser-cut holes provide consistent solder ball distribution, minimizing errors and improving success rates during IC rework.

The thin and flexible design allows easy handling and perfect fitting on IC chips, making it ideal for technicians working on motherboard-level repairs. Whether you’re restoring baseband ICs, power ICs, or other chips, the MaAnt IP8-8P-X stencil delivers precision, efficiency, and repeatable results.

⚙️ Key Features

• 🎯 Precision Laser-Cut Design – Accurate solder ball alignment
• 📱 iPhone 8 / 8 Plus Compatibility – Tailored for specific IC repair
• 🛡️ High-Quality Stainless Steel – Durable and heat-resistant
• 🔬 Ultra-Fine Hole Pattern – Ensures uniform tin planting
• 🔄 Flexible & Easy to Use – Perfect fit for IC chips
• ⚡ Improves Reballing Efficiency – Reduces errors and rework
• 🛠️ Professional Tool – Ideal for advanced motherboard repair

📊 Technical Specifications