MaAnt C1 Magnetodynamic Tin Planting Platform with 69pcs Stencil Set

Rs.6,598.00

MaAnt C1 tin planting platform with 69 stencils offers precise magnetic fixing for efficient BGA reballing and IC repair work.

Out of stock

MaAnt C1 Magnetodynamic Tin Planting Platform with 69pcs Stencil Set for BGA Reballing

The MaAnt C1 Tin Planting Platform is a professional-grade solution designed for BGA reballing, IC tin planting, and precision motherboard repair. Equipped with an advanced magnetodynamic fixing system, this platform ensures stable and accurate positioning of IC chips during solder ball placement, improving efficiency and reducing errors.

This complete kit includes 69 high-precision stencil sheets, covering a wide range of IC models and mobile repair applications. The strong magnetic adsorption design securely holds stencils and chips in place, allowing technicians to perform consistent and clean solder ball planting without movement.

Built with durable, heat-resistant materials, the MaAnt C1 platform is engineered to withstand high-temperature rework processes. Its ergonomic and compact design makes it suitable for both professional repair labs and advanced DIY users.

Whether you’re working on smartphone IC reballing or advanced PCB repair, the MaAnt C1 delivers precision, stability, and reliable performance for high-quality results.


⚙️ Key Features

  • 🧲 Magnetodynamic Fixing System – Strong and stable IC positioning
  • 🔧 69pcs Stencil Set Included – Wide compatibility for multiple IC models
  • 🔬 High Precision Alignment – Ensures accurate tin planting
  • 🔥 Heat-Resistant Platform – Suitable for high-temperature rework
  • 🎯 Improves Efficiency – Reduces errors in BGA reballing
  • 📏 Compact & Ergonomic Design – Easy to use and store
  • 🛠️ Professional Tool – Ideal for mobile and motherboard repair

📊 Technical Specifications

SpecificationDetails
BrandMaAnt
ModelC1
Product TypeTin Planting Platform / BGA Reballing Tool
Fixing MechanismMagnetodynamic System
Stencils Included69 Pieces
MaterialHeat-Resistant Industrial Material
StabilityHigh Precision Magnetic Fixation
ApplicationBGA Reballing, IC Tin Planting
CompatibilityMobile ICs, PCB Components
Usage TypeProfessional & DIY

 

 

 

Weight1.5 kg
Dimensions20 × 18 × 15 cm