MaAnt Magnetic Power C1 CPU Tin Planting BGA Reballing Stencil for MTK MT6761V / MT6762V / MT6765V

MaAnt Magnetic Power C1 CPU Tin Planting BGA Reballing Stencil for MTK MT6761V / MT6762V / MT6765V – Professional MediaTek CPU Reballing & Tin Planting Platform

The MaAnt Magnetic Power C1 CPU Tin Planting BGA Reballing Stencil for MTK MT6761V / MT6762V / MT6765V is a professional-grade chip-level repair solution engineered for motherboard specialists, BGA technicians, microsoldering engineers, and advanced mobile repair professionals who require precise solder ball planting and dependable chip alignment for MediaTek CPU restoration. Specifically designed for MTK MT6761V, MT6762V, and MT6765V chipsets, this precision stencil platform supports accurate CPU reballing, solder tin planting, and chip pad reconstruction for board-level smartphone repair.

Built for demanding BGA workflows, the MaAnt Magnetic Power C1 features a magnetic positioning system that improves stencil alignment stability, reduces shifting during solder ball placement, and enhances repair consistency. Its precision aperture design supports uniform solder ball distribution across CPU pads, helping technicians achieve cleaner, faster, and more accurate reballing results for compatible MTK processors. Designed for professional motherboard workshops, this stencil is ideal for restoring damaged solder joints, repairing boot faults, and extending CPU board usability.

Key Features

• Dedicated MTK CPU Compatibility: Specifically designed for MT6761V / MT6762V / MT6765V MediaTek CPUs
• Magnetic Positioning System: Enhances stencil alignment stability during reballing
• Precision Tin Planting Design: Supports accurate solder ball placement for chip pad restoration
• Professional BGA Reballing Utility: Ideal for CPU repair, motherboard servicing, and chip refurbishment
• High-Accuracy Aperture Layout: Uniform solder distribution for cleaner rework results
• Reduced Stencil Movement: Magnetic hold improves efficiency and lowers placement error
• Durable Precision Steel Construction: Built for repeated workshop-grade use
• Advanced Microsoldering Support: Suitable for CPU boot repair, no-display faults, and chip replacement
• Optimized for Professional Technicians: Helps improve reballing speed and consistency
• Compact Repair Platform: Easy integration into BGA repair stations

Technical Specifications

• Brand: MaAnt
• Model: Magnetic Power C1
• Product Type: CPU Tin Planting / BGA Reballing Stencil
• Chip Compatibility: MTK MT6761V / MT6762V / MT6765V
• Primary Applications: CPU reballing, solder ball planting, motherboard repair, chip refurbishment
• Alignment Type: Magnetic positioning
• Material: Precision-grade steel / stencil alloy
• Special Features: Magnetic stability, precise aperture design, uniform solder placement
• Usage Scope: Mobile motherboard repair, BGA chip servicing, MediaTek CPU restoration
• Target Users: BGA technicians, GSM engineers, motherboard repair professionals