Qianli QS209 Black Stencil for Precision BGA Reballing & iPhone PCB Repair

Qianli QS209 Black Stencil for Precision BGA Reballing & iPhone PCB Repair

The Qianli QS209 Black Stencil is a premium-quality reballing tool engineered for high-precision BGA soldering and advanced iPhone motherboard repair. Designed for professional technicians, this stencil ensures accurate solder ball placement and consistent reballing results, making it ideal for IC-level repairs.

Manufactured using high-grade stainless steel with a special black coating, the QS209 offers enhanced durability, improved heat resistance, and reduced glare during operation. Its ultra-fine laser-cut holes provide uniform tin planting, ensuring clean and reliable solder joints across delicate chip components.

The stencil’s ultra-thin and flexible structure allows precise alignment over IC chips, improving work efficiency and minimizing errors during reballing. Suitable for a wide range of smartphone ICs, especially iPhone models, the Qianli QS209 stencil is a must-have for professional repair labs.

⚙️ Key Features

• 🎯 High Precision Laser-Cut Design – Accurate solder ball alignment
• 🖤 Black Coated Surface – Reduces glare and improves visibility
• 🛡️ Stainless Steel Construction – Durable and heat-resistant
• 🔬 Ultra-Fine Hole Pattern – Uniform and clean reballing
• 🔄 Flexible & Thin Design – Easy placement and removal
• ⚡ Improves Repair Efficiency – Faster and more accurate work
• 🛠️ Professional Tool – Ideal for BGA and PCB repair

📊 Technical Specifications