AMAOE A19PRO STENCIL

AMAOE A19PRO BGA Reballing Stencil for Precision IC & Chip Repair

The AMAOE A19PRO Stencil is a high-precision BGA reballing stencil designed for professional IC chip repair, motherboard rework, and advanced mobile servicing. Built with cutting-edge manufacturing technology, this stencil ensures accurate solder ball placement and consistent reballing performance.

Crafted from premium-grade stainless steel, the A19PRO stencil offers excellent durability, heat resistance, and long service life. Its precisely etched mesh pattern allows uniform solder paste distribution, reducing errors and improving efficiency during CPU, GPU, and power IC reballing.

The stencil is designed for easy alignment and stable positioning, making it suitable for both experienced technicians and advanced DIY users. Its high-quality construction ensures minimal deformation under heat, maintaining accuracy even after repeated use.

Whether you’re repairing smartphones, tablets, or other electronic devices, the AMAOE A19PRO Stencil delivers precision, reliability, and professional-grade results.

Key Features

• High-precision BGA reballing stencil
• Made from durable stainless steel material
• Accurate hole alignment for perfect solder placement
• Heat-resistant and deformation-resistant design
• Ensures uniform solder paste distribution
• Ideal for CPU, GPU, and IC chip repair
• Easy to align and operate
• Long-lasting and reusable
• Improves repair efficiency and accuracy
• Suitable for professional technicians

Technical Specifications