AMAOE OnePlus 13T Stencil

AMAOE 1+13T-012 BGA Reballing Stencil for OnePlus 13T (70×70mm Precision Steel Mesh)

The AMAOE 1+13T-012 Stencil for OnePlus 13T (70×70mm) is a high-precision tool designed for BGA reballing and IC repair on OnePlus devices. Engineered with advanced etching technology, this stencil ensures accurate solder ball alignment and consistent reballing results, making it ideal for professional mobile technicians.

Manufactured from premium stainless steel, the stencil offers excellent durability, heat resistance, and long-term usability. The precise hole positioning allows for perfect solder paste application, reducing errors and improving repair efficiency during CPU, GPU, and power IC reballing.

Its 70×70mm standard size provides stability and compatibility with various rework setups, ensuring easy handling and reliable performance. The stencil is specifically designed for the OnePlus 13T chipset layout, delivering optimal results for advanced motherboard repairs.

Whether you are performing chip-level repairs or professional servicing, the AMAOE OnePlus 13T Stencil ensures precision, efficiency, and high-quality reballing performance.

Key Features

• Designed for OnePlus 13T IC reballing
• High-precision laser-etched stencil holes
• Made from durable stainless steel material
• Accurate alignment for perfect solder ball placement
• Heat-resistant and long-lasting construction
• Reduces reballing errors and improves efficiency
• Suitable for CPU, GPU, and power IC repair
• Standard 70×70mm size for stability
• Easy to use for professional technicians
• High-quality and reliable performance

Technical Specifications