Amaoe IP18 Series Middle Layer BGA Reballing Stencil Tin Plating Platform Set for iPhone 18 Pro / 18 Pro Max

Amaoe IP18 Series Middle Layer BGA Reballing Stencil Tin Plating Platform Set for iPhone 18 Pro / 18 Pro Max

The Amaoe IP18 Series Middle Layer BGA Reballing Stencil Tin Plating Platform Set is a specialized motherboard repair fixture designed for precision middle-layer BGA reballing and tin plating work on iPhone 18 Pro and iPhone 18 Pro Max logic boards. It provides controlled positioning and stable support during delicate board-level repair procedures.

Designed for professional mobile phone repair technicians, the platform helps improve alignment between the motherboard and reballing stencil during solder ball placement, tin planting, and middle-layer repair. Its dedicated design makes it easier to handle intricate BGA areas while reducing unnecessary movement during the repair process.

The Amaoe IP18 Series platform set is suitable for technicians working on advanced iPhone motherboard repairs, BGA reballing, chip-related servicing, and other precision micro-soldering applications.

Key Features

• Dedicated iPhone 18 Series Design – Designed for iPhone 18 Pro and iPhone 18 Pro Max motherboard repair applications.
• Middle Layer BGA Reballing – Suitable for precise middle-layer BGA chip reballing procedures.
• Tin Plating Platform – Provides stable support during tin planting and solder ball application.
• Precision Stencil Alignment – Helps maintain accurate positioning between the motherboard and stencil.
• Stable Repair Support – Reduces board movement during delicate repair operations.
• Professional BGA Repair Tool – Ideal for advanced motherboard and micro-soldering technicians.
• Specialized Fixture Set – Combines the required platform and stencil-based workflow for efficient repair.
• Improved Work Efficiency – Helps streamline repetitive BGA reballing and tin plating tasks.
• Suitable for Board-Level Repair – Designed for professional logic board servicing and chip repair.
• Amaoe Quality – Built as a dedicated precision repair accessory for modern smartphone motherboard work.

Technical Specifications