AMAOE IPDY-1 Stencil – Precision BGA Reballing Stencil for iPhone Repair
The AMAOE IPDY-1 Stencil is a high-precision BGA reballing stencil designed for professional iPhone motherboard repair and IC reballing work. Manufactured using premium stainless steel and advanced laser-cut technology, this stencil ensures accurate solder ball placement and perfect alignment during chip rework.
Built for professional GSM technicians, the IPDY-1 stencil provides excellent heat resistance and durability, making it ideal for repeated use in repair labs and service centers. Its ultra-thin and precisely engineered design allows smooth solder paste application while preventing solder bridging during the reballing process.
Whether you are repairing iPhone logic boards, replacing IC chips, or performing advanced motherboard repairs, the Amaoe IPDY-1 stencil helps deliver consistent and reliable repair results.
Key Features
- High-precision laser-cut BGA stencil design
- Made from premium stainless steel for durability
- Designed for iPhone motherboard IC reballing
- Ultra-thin structure for accurate solder ball alignment
- High heat resistance for soldering and rework stations
- Prevents solder bridging and improves repair success rate
- Reusable and long-lasting professional repair tool
- Suitable for GSM repair technicians and repair labs
Technical Specifications
| Specification | Details |
|---|---|
| Product Name | AMAOE IPDY-1 Stencil |
| Brand | Amaoe |
| Material | High-Quality Stainless Steel |
| Type | BGA Reballing Stencil |
| Application | iPhone IC / Motherboard Repair |
| Manufacturing | Precision Laser Cut |
| Heat Resistance | High Temperature Resistant |
| Usage | Professional Mobile Repair |
| Compatibility | iPhone Logic Board IC Reballing |
| Condition | New |
