Amaoe OV-7 Stencil for Oppo/Vivo – Precision BGA Reballing Stencil
The Amaoe OV-7 Stencil for Oppo/Vivo is a professional BGA reballing stencil designed specifically for repairing Oppo and Vivo smartphone motherboard ICs. Crafted with high-quality stainless steel and advanced laser-cut technology, this stencil ensures precise solder ball alignment and reliable chip reballing during mobile repair operations.
This high-precision stencil is widely used by GSM technicians and professional repair engineers for accurate IC rework, CPU reballing, and motherboard maintenance. Its ultra-thin design allows easy solder paste application while maintaining excellent heat resistance during hot air or reflow soldering processes.
The Amaoe OV-7 stencil is durable, reusable, and engineered to deliver consistent repair results, making it an essential tool for modern smartphone motherboard repair.
Key Features
- Professional BGA reballing stencil for Oppo and Vivo devices
- Made from premium stainless steel for long-lasting durability
- High-precision laser-cut holes for perfect solder ball alignment
- Ultra-thin design for accurate IC positioning
- High temperature resistant for hot air rework stations
- Helps prevent solder bridging and improves repair quality
- Suitable for CPU, power IC, and motherboard chip repairs
- Ideal tool for mobile repair technicians and service centers
Technical Specifications
| Specification | Details |
|---|---|
| Product Name | Amaoe OV-7 Stencil |
| Brand | Amaoe |
| Material | Stainless Steel |
| Type | BGA Reballing Stencil |
| Compatibility | Oppo / Vivo Smartphones |
| Manufacturing | Precision Laser Cutting |
| Thickness | Ultra Thin Precision Design |
| Heat Resistance | High Temperature Resistant |
| Application | Mobile IC & CPU Reballing |
| Usage | Professional Mobile Repair |












