Amaoe U-QSD10 Stencil
The Amaoe U-QSD10 Stencil is a professional BGA reballing stencil designed for accurate reballing and repair of smartphone Qualcomm CPU, PMIC, and related IC chips. Manufactured using premium stainless steel and advanced laser-cut technology, this stencil ensures precise solder ball alignment for high-quality chip-level repairs.
Its ultra-thin structure allows technicians to easily position the stencil over delicate IC components while maintaining excellent heat resistance during the soldering process. The precision apertures help distribute solder balls evenly, minimizing solder bridging and improving repair accuracy.
Ideal for professional GSM technicians and mobile repair labs, the Amaoe U-QSD10 stencil is a reliable tool for advanced smartphone motherboard repair, BGA chip rework, and Qualcomm chipset maintenance.
Key Features
- Professional BGA reballing stencil for Qualcomm IC repair
- Precision laser-cut holes for accurate solder ball placement
- Made from high-quality stainless steel material
- Ultra-thin design for easy chip alignment
- Ensures uniform solder ball distribution
- Excellent heat resistance during soldering
- Reduces solder bridging and repair errors
- Reusable and durable repair stencil
- Suitable for advanced smartphone motherboard repair
- Ideal for mobile repair technicians and GSM workshops
Technical Specifications
- Product Name: Amaoe U-QSD10 Stencil
- Brand: Amaoe
- Model: U-QSD10
- Material: Premium Stainless Steel
- Type: BGA Reballing Stencil
- Manufacturing Method: Precision Laser Cutting
- Application: CPU / PMIC / IC Reballing
- Compatibility: Qualcomm Chipset Motherboards
- Heat Resistance: High Temperature Resistant
- Usage: Professional Mobile Phone Repair
