Amaoe U-QSD9 Stencil
The Amaoe U-QSD9 Stencil is a professional BGA reballing stencil engineered for precise repair and reballing of Qualcomm-based smartphone CPU, PMIC, and IC chips. Built with high-quality stainless steel and manufactured using advanced laser-cut technology, this stencil ensures accurate solder ball placement for reliable chip-level repairs.
Its ultra-thin structure allows technicians to align the stencil perfectly over delicate IC chips, ensuring smooth solder paste application and excellent heat distribution during the soldering process. The precision-cut apertures provide uniform solder ball distribution, helping reduce solder bridging and improving the success rate of motherboard repairs.
Designed for professional GSM technicians and repair labs, the Amaoe U-QSD9 stencil is an essential tool for advanced smartphone motherboard repair, BGA chip rework, and Qualcomm chipset maintenance.
Key Features
- Professional BGA reballing stencil for Qualcomm chipset repair
- Precision laser-cut holes for accurate solder ball placement
- Made from premium stainless steel for durability
- Ultra-thin design for easy chip alignment and positioning
- Ensures uniform solder ball distribution
- Excellent heat resistance during soldering process
- Helps reduce solder bridging and alignment errors
- Reusable and durable repair stencil
- Ideal for advanced smartphone motherboard repair
- Perfect for mobile repair technicians and GSM workshops
Technical Specifications
- Product Name: Amaoe U-QSD9 Stencil
- Brand: Amaoe
- Model: U-QSD9
- Material: High-Quality Stainless Steel
- Type: BGA Reballing Stencil
- Manufacturing Process: Precision Laser Cutting
- Application: CPU / PMIC / IC Reballing
- Compatibility: Qualcomm Chipset Motherboards
- Heat Resistance: High Temperature Resistant
- Usage: Professional Mobile Phone Repair
