Amaoe U-QSD8 Stencil
The Amaoe U-QSD8 Stencil is a professional BGA reballing stencil designed for precise chip-level repair of Qualcomm-based smartphone motherboards. Manufactured using premium stainless steel and precision laser cutting technology, this stencil ensures accurate solder ball alignment for CPU, PMIC, and other IC components.
The ultra-thin structure allows technicians to easily position the stencil over delicate chips, ensuring stable alignment and efficient heat transfer during soldering. Its precisely engineered apertures help distribute solder balls evenly, minimizing solder bridging and improving the success rate of reballing operations.
Ideal for professional GSM technicians and repair labs, the Amaoe U-QSD8 stencil is an essential tool for advanced smartphone motherboard repair, Qualcomm chipset reballing, and BGA IC restoration, delivering reliable and consistent repair results.
Key Features
- Professional BGA reballing stencil for Qualcomm IC repair
- High-precision laser-cut holes for accurate solder ball placement
- Made from premium stainless steel material for durability
- Ultra-thin design for easy chip alignment
- Ensures uniform solder ball distribution
- Excellent heat resistance for soldering work
- Helps reduce solder bridging and alignment errors
- Reusable and durable repair tool
- Suitable for advanced smartphone motherboard repairs
- Ideal for mobile repair technicians and GSM workshops
Technical Specifications
- Product Name: Amaoe U-QSD8 Stencil
- Brand: Amaoe
- Model: U-QSD8
- Material: High-Quality Stainless Steel
- Type: BGA Reballing Stencil
- Manufacturing Process: Precision Laser Cutting
- Application: CPU / PMIC / IC Reballing
- Compatibility: Qualcomm Chipset Motherboards
- Heat Resistance: High Temperature Resistant
- Usage: Professional Mobile Phone Repair
