Amaoe U-QSD7 Stencil
The Amaoe U-QSD7 Stencil is a high-precision BGA reballing stencil designed for advanced smartphone motherboard repair, particularly for Qualcomm chipset CPU, PMIC, and IC components. Manufactured using premium stainless steel and precision laser-cut technology, this stencil ensures accurate solder ball placement for reliable chip-level reballing.
Its ultra-thin and durable design allows technicians to position the stencil perfectly over IC chips, enabling smooth solder paste application and excellent heat transfer during soldering. The precisely engineered apertures help distribute solder balls evenly, minimizing solder bridging and improving repair accuracy.
The Amaoe U-QSD7 stencil is widely used by professional GSM technicians and repair labs for Qualcomm chipset maintenance, BGA chip rework, and smartphone motherboard restoration, making it an essential tool for precise and efficient mobile device repairs.
Key Features
- Professional BGA reballing stencil for Qualcomm chipset repair
- Precision laser-cut holes for accurate solder ball alignment
- Made from premium stainless steel for long-lasting durability
- Ultra-thin structure for perfect chip positioning
- Ensures uniform solder ball distribution
- High temperature resistance for soldering work
- Helps reduce solder bridging and reballing errors
- Reusable and durable repair stencil
- Ideal for advanced smartphone motherboard repairs
- Perfect for professional GSM technicians
Technical Specifications
- Product Name: Amaoe U-QSD7 Stencil
- Brand: Amaoe
- Model: U-QSD7
- Material: High-Quality Stainless Steel
- Type: BGA Reballing Stencil
- Manufacturing Method: Precision Laser Cutting
- Application: CPU / PMIC / IC Reballing
- Compatibility: Qualcomm Chipset Motherboards
- Heat Resistance: High Temperature Resistant
- Usage: Professional Mobile Phone Repair
