Amaoe U-QSD6 Stencil
The Amaoe U-QSD6 Stencil is a professional BGA reballing stencil engineered for precise reballing of Qualcomm CPU, PMIC, and IC chips used in modern smartphone motherboards. Designed for advanced mobile repair technicians, this stencil ensures accurate solder ball placement, helping restore damaged or faulty chips with high precision.
Manufactured from premium-grade stainless steel with precision laser-cut holes, the Amaoe U-QSD6 stencil provides excellent durability and perfect alignment during the reballing process. Its ultra-thin structure allows smooth solder paste application while maintaining stable positioning on the chip surface.
This stencil is widely used in professional GSM repair labs for chip-level motherboard repair, IC rework, and CPU reballing tasks, ensuring reliable solder joints and minimizing solder bridging. Whether you are repairing Qualcomm-based smartphones or performing advanced BGA chip rework, the Amaoe U-QSD6 stencil is an essential tool for efficient and accurate repairs.
Key Features
- Precision BGA reballing stencil for Qualcomm chipset repair
- Laser-cut holes for accurate solder ball alignment
- Made from high-quality stainless steel for durability
- Ultra-thin design for precise chip positioning
- Ensures uniform solder ball distribution
- High temperature resistance during soldering
- Reduces solder bridging and rework errors
- Suitable for CPU, PMIC, and IC chip reballing
- Reusable professional repair stencil
- Ideal for mobile motherboard repair technicians
Technical Specifications
- Product Name: Amaoe U-QSD6 Stencil
- Brand: Amaoe
- Model: U-QSD6
- Material: Premium Stainless Steel
- Type: BGA Reballing Stencil
- Manufacturing Process: Precision Laser Cutting
- Application: CPU / PMIC / IC Reballing
- Compatibility: Qualcomm Chipset Motherboards
- Heat Resistance: High Temperature Resistant
- Usage: Professional Mobile Phone Repair
