Amaoe U-QSD4 Stencil

The Amaoe U-QSD4 Stencil is a high-precision BGA reballing stencil specially designed for repairing Qualcomm CPU, PMIC, and motherboard IC chips in modern smartphones. Built for professional mobile technicians, this stencil enables accurate and consistent solder ball placement during chip-level motherboard repairs.

Crafted from premium stainless steel with advanced laser-cut technology, the stencil ensures perfect alignment and uniform solder ball distribution. Its ultra-thin structure allows smooth solder paste application while maintaining stability during heating and soldering.

The Amaoe U-QSD4 stencil is an essential tool for technicians performing Qualcomm chipset reballing, IC replacement, and motherboard repair. With excellent durability and high temperature resistance, it provides reliable performance for daily repair work in GSM repair laboratories and service centers.

Key Features

• Professional BGA reballing stencil for Qualcomm chip repair
• Precision laser-cut holes for accurate solder ball placement
• Made from high-quality stainless steel
• Ultra-thin design for precise chip alignment
• Ensures uniform solder ball distribution
• High temperature resistant during soldering
• Reduces risk of solder bridging and misalignment
• Suitable for CPU, PMIC, and IC chip reballing
• Durable and reusable professional repair stencil
• Perfect for mobile motherboard chip-level repair

Technical Specifications

• Product Name: Amaoe U-QSD4 Stencil
• Brand: Amaoe
• Model: U-QSD4
• Material: High-quality Stainless Steel
• Type: BGA Reballing Stencil
• Manufacturing Process: Precision Laser Cutting
• Application: CPU / PMIC / IC Reballing
• Chipset Support: Qualcomm Based Motherboards
• Heat Resistance: High Temperature Resistant
• Usage: Professional Smartphone Motherboard Repair