Amaoe U-QSD3 Stencil

The Amaoe U-QSD3 Stencil is a professional BGA reballing stencil designed for precise repair of Qualcomm CPU, PMIC, and IC chips used in modern smartphones. It is an essential tool for mobile technicians performing advanced chip-level motherboard repairs and IC reballing.

Manufactured with high-quality stainless steel and precision laser cutting technology, the stencil ensures accurate solder ball alignment and consistent results during the reballing process. Its ultra-thin design allows smooth solder paste application while maintaining perfect chip positioning.

The Amaoe U-QSD3 offers excellent durability and heat resistance, making it suitable for repeated professional use in mobile repair labs. With precise hole alignment and high manufacturing accuracy, it minimizes solder bridging and improves repair efficiency for Qualcomm-based devices.

Whether you are replacing IC chips or performing CPU reballing, the Amaoe U-QSD3 stencil delivers reliable and professional repair performance.

Key Features

• Professional BGA reballing stencil for Qualcomm chipset repair
• Precision laser-cut holes for accurate solder ball placement
• Made from premium stainless steel material
• Ultra-thin design for perfect chip alignment
• Supports CPU, PMIC, and IC chip reballing
• High temperature resistant during soldering process
• Prevents solder bridging and alignment errors
• Durable and reusable for long-term use
• Ideal for smartphone motherboard repair technicians
• Ensures clean and consistent soldering results

Technical Specifications

• Product Name: Amaoe U-QSD3 Stencil
• Brand: Amaoe
• Model: U-QSD3
• Material: Stainless Steel
• Type: BGA Reballing Stencil
• Manufacturing: Precision Laser Cutting
• Application: CPU / PMIC / IC Reballing
• Chipset Support: Qualcomm Based Smartphones
• Heat Resistance: High Temperature Resistant
• Usage: Professional Mobile Motherboard Repair