Amaoe U-QSD2 Stencil

The Amaoe U-QSD2 Stencil is a professional-grade BGA reballing stencil designed specifically for precise reballing of Qualcomm CPU, PMIC, and IC chips used in modern smartphones. It is an essential repair tool for technicians performing advanced motherboard chip-level repairs.

Made with high-quality stainless steel and precision laser-cut technology, the stencil ensures accurate solder ball positioning and clean soldering results. Its ultra-thin and durable design allows technicians to perform reballing with excellent alignment, reducing the risk of solder bridging and chip damage.

The Amaoe U-QSD2 stencil supports multiple Qualcomm chipset configurations and is widely used in professional GSM repair labs for efficient IC repair and replacement. With high heat resistance and long-lasting durability, it provides consistent results even after repeated use.

This stencil is ideal for mobile repair professionals who require reliable tools for accurate CPU and IC reballing work.

Key Features

• Professional BGA reballing stencil for Qualcomm CPU repair
• Precision laser-cut holes for accurate solder ball alignment
• Manufactured from premium stainless steel
• Ultra-thin design for perfect chip positioning
• Suitable for CPU, PMIC, and IC chip reballing
• High heat resistance for soldering operations
• Reduces solder bridging and alignment errors
• Durable and reusable for long-term use
• Ideal for professional smartphone motherboard repair
• Ensures clean and consistent reballing results

Technical Specifications

• Product Name: Amaoe U-QSD2 Stencil
• Brand: Amaoe
• Model: U-QSD2
• Material: High-Quality Stainless Steel
• Type: BGA Reballing Stencil
• Manufacturing Method: Precision Laser Cutting
• Application: CPU / PMIC / IC Reballing
• Chipset Compatibility: Qualcomm Based Smartphones
• Heat Resistance: High Temperature Resistant
• Usage: Professional Mobile Phone Motherboard Repair