Luowei LW-PT01 Tin Planting Platform

Luowei LW-PT01 Tin Planting Platform

The Luowei LW-PT01 Mid-Level Positioning Tin Planting Platform Zero Error for iPhone X–16 Pro Max is a professional BGA reballing and tin planting platform designed for advanced motherboard repair and chip-level maintenance applications. Engineered for repair technicians and electronics professionals, this precision platform delivers highly accurate positioning, stable alignment, and efficient solder ball planting performance for iPhone motherboard repair operations.

Compatible with iPhone X to iPhone 16 Pro Max, the LW-PT01 supports precise CPU, NAND, and IC reballing tasks with enhanced alignment accuracy and reduced positioning errors. Its advanced mid-level positioning structure helps technicians achieve stable solder ball placement and consistent repair quality during delicate BGA maintenance procedures.

Manufactured using durable high-quality alloy materials, the platform offers excellent heat resistance, anti-deformation performance, and long-lasting reliability for professional soldering environments. The zero-error precision design improves work efficiency while minimizing soldering mistakes during motherboard refurbishment and chip replacement operations.

Compact, stable, and technician-friendly, the Luowei LW-PT01 is an essential repair platform for professional mobile repair laboratories, refurbishment centers, and advanced electronics maintenance workshops.

Key Features:

• Professional Tin Planting & BGA Reballing Platform
• Compatible with iPhone X to 16 Pro Max
• Zero-Error Precision Positioning Structure
• Mid-Level Alignment System for Accurate Placement
• Ideal for CPU, NAND & IC Reballing Tasks
• Stable High-Temperature Resistant Construction
• Improves Solder Ball Placement Accuracy
• Durable Anti-Deformation Alloy Material
• Enhances Repair Efficiency & Stability
• Perfect for Professional Repair Workshops

Technical Specifications:

• Product Name: Luowei LW-PT01 Tin Planting Platform
• Model: LW-PT01
• Type: BGA reballing positioning platform
• Compatibility: iPhone X to iPhone 16 Pro Max
• Function: Tin planting and IC positioning
• Application: Motherboard repair and chip maintenance
• Material: High-quality heat-resistant alloy
• Features: Zero-error alignment and stable positioning
• Usage: CPU, NAND, and IC reballing work
• Suitable For: Technicians and repair laboratories