AMAOE Stencil-RF1

The AMAOE Stencil-RF1 is a professional reballing and chip alignment stencil expertly crafted for mobile motherboard repair tasks. Built with premium stainless steel and precision laser cutting, this stencil ensures exact solder ball placement and minimizes repair errors for technicians. Whether you’re performing BGA reballing, IC alignment, or socket rework, the AMAOE Stencil RF1 delivers consistent and reliable results for demanding repair workflows. A must-have tool for mobile repair professionals and hobbyists alike, this stencil improves accuracy, durability, and workflow speed — making even complex repairs easier and more precise.

Key Features:

• Designed for precise mobile motherboard IC reballing
• Laser-cut stainless steel for high accuracy
• Ensures uniform solder ball alignment
• Reduces bridging and soldering mistakes
• Durable corrosion-resistant build
• Improves repair efficiency and workflow
• Easy to use and align with board components
• Reusable tool for repeated repairs
• Ideal for professional technicians
• Compact and portable design

Technical Specifications:

• Brand: AMAOE
• Model: Stencil-RF1
• Material: Stainless steel
• Technology: Precision laser-cut holes
• Application: IC/BGA reballing and chip alignment
• Thickness: Approx. 0.12–0.15 mm
• Reusable: Yes
• Compatibility: Mobile phone motherboards (various models)
• Finish: Anti-rust metallic
• Weight: Approx. 10–20 g