Amaoe HW-7 Stencil for Honor/Huawei

Amaoe HW-7 Stencil for Honor/Huawei

The Amaoe HW-7 Stencil for Honor/Huawei is a precision-engineered BGA reballing stencil designed specifically for repairing and reworking Honor and Huawei smartphone motherboards. Built with high-quality stainless steel and advanced laser-cut technology, this stencil delivers exceptional accuracy for chip-level solder paste placement and uniform solder ball alignment.

Whether you’re replacing power ICs, chipset modules, or other BGA components, the HW-7 stencil helps reduce solder bridging, improve electrical contacts, and enhance repair success rates. Its heat-resistant and corrosion-proof design ensures durability and repeatable performance even in high-temperature hot-air rework environments. A must-have tool for professional mobile repair workshops and advanced DIY technicians, this stencil boosts repair precision, speed, and consistency.

Key Features:

• Specially designed for Honor & Huawei BGA reballing
• Precision laser-cut stainless steel construction
• Ensures uniform solder ball distribution
• Minimizes bridging and soldering defects
• High heat resistance for hot-air rework processes
• Corrosion-proof and anti-rust surface finish
• Reusable and easy to clean after use
• Improves alignment accuracy and workflow efficiency
• Lightweight and easy to position on motherboard pads
• Ideal for professional repair technicians

Technical Specifications:

• Brand: Amaoe
• Model: HW-7
• Material: Premium stainless steel
• Application: Honor & Huawei BGA IC reballing
• Thickness: Approx. 0.12 mm – 0.15 mm
• Precision Tolerance: ±0.01 mm
• Finish: Anti-corrosion metallic surface
• Reusable: Yes
• Weight: Approx. 10–20 g
• Compatibility: Honor & Huawei motherboard BGA chips