Amaoe MZ-5 Stencil

The Amaoe MZ-5 Stencil is a high-precision BGA reballing stencil developed for accurate IC chip repair and motherboard rework. Manufactured from premium stainless steel using advanced laser-cut technology, this stencil ensures perfect solder ball alignment and consistent solder paste distribution during reballing tasks.

Engineered for professional mobile repair technicians and advanced PCB specialists, the MZ-5 stencil helps reduce solder bridging, improve joint reliability, and enhance overall repair efficiency. Its heat-resistant and corrosion-resistant design supports repeated use under hot air stations and reflow systems without deformation.

Whether you’re replacing BGA chips, repairing motherboard faults, or performing detailed IC servicing, the Amaoe MZ-5 stencil delivers reliable, clean, and professional-level results every time.

Key Features:

• Precision laser-cut stainless steel construction
• Designed for accurate BGA IC reballing
• Ensures uniform solder ball distribution
• Minimizes solder bridging and alignment errors
• High heat resistance for hot air and reflow use
• Durable, anti-rust, and reusable design
• Enhances solder joint strength and conductivity
• Lightweight and easy PCB positioning
• Suitable for advanced board-level repairs
• Ideal for professional repair workshops

Technical Specifications:

• Brand: Amaoe
• Model: MZ-5
• Material: Premium stainless steel
• Application: BGA IC reballing and motherboard repair
• Thickness: Approx. 0.12 mm – 0.15 mm
• Precision Tolerance: ±0.01 mm
• Surface Finish: Anti-corrosion metallic coating
• Reusable: Yes
• Weight: Approx. 10–20 g
• Compatibility: Various BGA IC chip layouts (model-specific design)