Amaoe MZ-7 Stencil

The Amaoe MZ-7 Stencil is a high-precision BGA reballing stencil engineered for advanced motherboard repair and IC chip servicing. Manufactured using premium-grade stainless steel and ultra-precise laser cutting technology, this stencil ensures accurate solder ball alignment and uniform paste distribution during rework procedures.

Designed for professional technicians and mobile repair workshops, the MZ-7 stencil enhances repair efficiency by reducing solder bridging and improving solder joint integrity. Its heat-resistant and corrosion-proof construction makes it suitable for repeated use with hot air rework stations and reflow machines.

Whether you are replacing BGA chips, repairing motherboard faults, or performing IC reballing tasks, the Amaoe MZ-7 stencil delivers consistent precision, durability, and professional-grade results.

Key Features:

• Precision laser-cut stainless steel construction
• Designed for accurate BGA IC reballing
• Ensures uniform solder ball placement
• Reduces solder bridging and alignment errors
• Heat-resistant for hot air and reflow applications
• Corrosion-proof and durable material
• Reusable and easy to clean
• Improves solder joint strength and reliability
• Lightweight and easy to position on PCB
• Ideal for professional motherboard repair technicians

Technical Specifications:

• Brand: Amaoe
• Model: MZ-7
• Material: Premium stainless steel
• Application: BGA IC reballing and motherboard repair
• Thickness: Approx. 0.12 mm – 0.15 mm
• Precision Tolerance: ±0.01 mm
• Surface Finish: Anti-rust metallic coating
• Reusable: Yes
• Weight: Approx. 10–20 g
• Compatibility: Various BGA IC chips (model-specific layout)