AMAOE HWB-1 Stencil
Rs.238.00
The AMAOE HWB-1 Stencil is a precision stainless steel BGA reballing stencil designed for accurate IC chip repair and professional smartphone motherboard servicing.
AMAOE HWB-1 Stencil
The AMAOE HWB-1 Stencil is a professional BGA reballing stencil designed for precise mobile motherboard IC repair and chip-level rework. Engineered with advanced laser-cut technology and high-quality stainless steel, this stencil ensures accurate solder ball placement and perfect alignment during the IC reballing process.
The AMAOE HWB-1 stencil is built for technicians who perform detailed smartphone motherboard repairs, helping them restore damaged or replaced IC chips with precision. Its ultra-thin structure allows smooth solder paste application and stable chip positioning during high-temperature soldering procedures.
Ideal for GSM technicians, mobile repair labs, and professional service centers, the AMAOE HWB-1 stencil enhances repair accuracy, reduces solder bridging, and ensures reliable BGA reballing performance.
Key Features
- High-precision BGA reballing stencil for IC chip repair
- Laser-cut micro holes for accurate solder ball placement
- Made from premium stainless steel for durability
- Ultra-thin design for precise IC alignment
- Heat resistant for professional soldering processes
- Helps reduce solder bridging and misalignment
- Suitable for mobile motherboard IC rework
- Ideal for professional smartphone repair technicians
Technical Specifications
| Specification | Details |
|---|---|
| Product Name | AMAOE HWB-1 Stencil |
| Brand | Amaoe |
| Model | HWB-1 |
| Material | High Quality Stainless Steel |
| Type | BGA Reballing Stencil |
| Manufacturing | Precision Laser Cut |
| Application | Mobile IC / Motherboard Repair |
| Heat Resistance | High Temperature Resistant |
| Usage | Professional Mobile Repair |
| Category | Mobile Repair Tool |
| Weight | 0.020 kg |
|---|---|
| Dimensions | 15 × 12 × 10 cm |
