AMAOE MZ-1 Stencil

The AMAOE MZ-1 Stencil is a high-precision BGA reballing stencil designed for advanced IC chip repair and motherboard rework. Manufactured from premium stainless steel using ultra-accurate laser cutting technology, this stencil ensures perfect solder ball alignment and consistent paste distribution during reballing procedures.

Ideal for professional mobile repair technicians and PCB specialists, the MZ-1 stencil minimizes solder bridging, enhances joint reliability, and improves overall repair accuracy. Its heat-resistant and corrosion-proof construction guarantees long-lasting performance even under repeated use with hot air stations and reflow systems.

Whether you are performing BGA chip replacement, CPU repair, or detailed motherboard servicing, the AMAOE MZ-1 stencil delivers clean, consistent, and professional-grade results every time.

Key Features:

• Precision laser-cut stainless steel construction
• Designed for accurate BGA IC reballing
• Ensures uniform solder ball placement
• Reduces solder bridging and alignment issues
• High heat resistance for hot air and reflow use
• Durable, anti-rust, and reusable design
• Improves solder joint strength and conductivity
• Lightweight and easy PCB positioning
• Suitable for advanced motherboard repair
• Ideal for professional repair workshops

Technical Specifications:

• Brand: AMAOE
• Model: MZ-1
• Material: Premium stainless steel
• Application: BGA IC reballing and motherboard repair
• Thickness: Approx. 0.12 mm – 0.15 mm
• Precision Tolerance: ±0.01 mm
• Surface Finish: Anti-corrosion metallic coating
• Reusable: Yes
• Weight: Approx. 10–20 g
• Compatibility: Various BGA IC chip layouts (model-specific)